Carsem China - Carsem (M) Sdn Bhd

Dedicated office for development engineers

With the debug ability on NI PXI, STS-T4, AMB7600/7600SR，Power Tech QT4100&QTT6000, ACCO8200/8300, AMIDA

Dedicated development room for hardware design & bench debug

With instrument : Keysight VNA E5071, SPECTRUM ANALYZER, DC Power supply, DMM, simulate load, LCR

Test Solutions For RF Product

Optional test platforms for different products

Tester	Switch	LNA	Splitter	ANT Tuner	Filter	4G/5G PA
LTX PAx AC	√	√	√	√	√	√
AMB7600	√	√	√	√	√	√
LTX CX	√	√	√	√	√	Χ
NI PXI	√	√	√	√	√	Χ

Rich development experience for RF product

2 dedicated development engineers focus on RF product
More than 10 years development experience on RF test.
Short implement cycle time(<1wk for nomal product)
Test time reduction: Test item/limit optimization base on test data analyzing, Test method change/wait time reduction
Major customer: ALP / MXD / RDA

Lost Solution with Ping-Pong mode

Ping-Pong mode benefit: 30% of test cost saving.

Low Cost Solution For TVS Product

Cost down solution

Tester efficiency

To develop test solution on QTT / AMI to support Ping-Pong model
Ping-Pong mode benefit: 30% of test cost saving.
Major customers: AMZ / LIF / WIS

Test time reduction

Test item/limit optimization base on data analyzing.
Test method change/wait time reduction.
AMZ / LIF / WIS (60ms-> 45ms)

Rich development experience for TVS product

Hardware design and PCB layout.
2 dedicated experienced engineers focus on TVS product development.
Short implement cycle time(1day for normal product after HW ready)

RF FEM Test Technology Roadmap

Key test parameter: Gain, PAE, Harmonic (2nd/3rd), P1dB/IP3, ACPR/EVM

Section5G RF PA/FEM Test Solution

Sub-6GHz 5G PA/FEM test

Higher frequency (3.3GHz~4.9GHz)
Higher bandwidth (>200MHz)
Sub-6GHz 5G RF test solution can be worked out by upgrading our existing tester and handler within 2 months.

mmWave test

Key test challenges at mmWave

Test Method of mmWave

Wireless test head needed
Isolation box needed(upgrading handler)
New Tester needed(NI-STS)

Test Readiness for 5G RF product

Product / Bandwidth	2G	3G	4G	5G
	800MHz~2GHz	2GHz~2.2GHz	1.7G~2.7G	3.3GHz~5.9GHz	>28GHz (mmWave)
	6MHz~24MHz	15MHz	15MHz~130MHz	<160MHz	>400MHz
Switch	√	√	√	√	Θ
Filter (SAW/BAW)	√	√	√	√	Θ
Diplexer / Multiplexer	√	√	√	√	Θ
PA (Power Amplifier)	√	√	√	√	Θ
LNA (Low Noise Amplifier)	√	√	√	√	Θ
Antenna Tuner	√	√	√	√	Θ
SiP (include 2 or more componenets into a package)	√	√	√	√	Θ

Θ = Under Development

Product / Bandwidth
2G
3G
4G
5G

800MHz~2GHz
2GHz~2.2GHz
1.7G~2.7G
3.3GHz~5.9GHz
>28GHz (mmWave)

6MHz~24MHz
15MHz
15MHz~130MHz
<160MHz
>400MHz

Switch
√
√
√
√
Θ

Filter (SAW/BAW)
√
√
√
√
Θ

Diplexer / Multiplexer
√
√
√
√
Θ

PA (Power Amplifier)
√
√
√
√
Θ

LNA (Low Noise Amplifier)
√
√
√
√
Θ

Antenna Tuner
√
√
√
√
Θ

SiP (include 2 or more componenets into a package)
√
√
√
√
Θ

Θ = Under Development

FEM Categories Vs Test

Technology Group	Handlers	Tester	Socket / Pin
Di-FEM (Filter+Switch) (<6GHz)	CSZ capable	CSZ capable	CSZ capable
LFEM (Switch+LNA) (<6GHz)	CSZ capable	CSZ capable	CSZ capable
PAMiD (PA+Filter) (<6GHz)	CSZ capable	CSZ capable	CSZ capable
Wifi FEM (<7.125GHz)	CSZ capable	CSZ capable	CSZ capable
mm Wave (>7.125GHz)	Under Roadmap	Under Roadmap	Under Roadmap

Test 5G Preparedness

Higher frequency (3.3GHz~4.9GHz)
Higher bandwidth(>160MHz)
400MHz can be worked out by upgrading our existing tester and handler within 2 months

Wireless test head needed
Isolation box needed(upgrading handler)
New Tester needed or upgraded (under development)

Carsem Suzhou overall tester model

Tester Type	Tester Model	Vendor	Qty	Origin	Capability
Mixed Signal	Eagle-364A	Teradyne	5	US	Support 2A max Current,100V max Vlotage, configC can up to 100A
	Eagle-364B		28	US
	Eagle-ETS88		10	US
	ASL1K	Cohu	36	US	45V,2A(Can up to 100A)
	STS8200	AccoTest	22	China	50V,10A
	QTT8100	PowerTech	1	China	120V,10A
	STS8300	AccoTest	7	China	100A Floating VI source
	Amida 3001XP	Amida	15	China	1A,45V
RF	LTX PAX	Cohu	3	US	PAxAC:2SG for the dual sites,16 RF ports 6GHz source and 8GHz RF measurement, 16dBm max source level, 250MHz measure bandwidth.
	PXI-NI	NI	108	US
	AMB7600	Aemulus	23	Malaysia	Aemulus: with wolfer option, can up to 35dBm source out
Discrete	QT6100	PowerTech	23	China	600V,3A
Discrete	QT4100B	PowerTech	12	China	DC: 1000V,100A; RG:4980A LCR meter& 25V max VDS; DVDS: 10A,200V; UIL: 200A Pulse,2000V& 0.01-59.9mH

RF tester roadmap

TVS tester roadmap

Remark: Soft docking, Short Test Time, Support Ping-pong, High Current (100A)

Final Test Capability

16/32 RF Ports
2 VST , Bandwidth 1G hz
Fequency <6G Hz
Digital channel: 32 /128M per channel

Quadrant output , fully Kelvin connections
Max DC ±10A / 40V
4K pattern depth, 16-Bit AWG per channel
Can be upgrade 20V/100A

Tester Develop Roadmap

Type

2006

2010

2015

2018

2022

Discrete

45V 2A
*ASL1000

DC 2000V 100A RG / CAP
*QT4100

600V 3A 3CHs
*QT6100

1200V 30A 6CHs
*QT6200

Mix Signal

45V 2A 14MHz
*ASL1000

100V 10A 66MHz
*Eagle 364

50V 10A 100M
*STS8200

100V 100A 100M
*ST8300

RF

*LTX CX

Frequency: <5.9G 90MHz
*AMB7600

Frequency: <6G 1GHz
*STS T4
PGT NI

Frequency: >28G (5G)
*NI STS

QT4100

QT6100

STS8200

STS8300

Eagle364

AMB7600

STS T4

PGT NI

Carsem Suzhou overall handler model

Handle Type	Handler Model	Vendor	Qty	PKG size	Origin	Capability
Turret	SRM XD248	SRM	47	MLP >= 2×2	Malaysia	Thickness > 0.4 Room Temp
	SRM Z208		110	MLP >= 1.0×0.6	Malaysia	Thickness > 0.25 Room Temp
	SRM Z208T		7	MLP >= 1×1	Malaysia	Thickness > 0.25 Room Temp
	SRM XD208		3	MLP >= 2×3	Malaysia	Thickness > 0.6 Room Temp
	SRM Z206		3	MLP >= 1×1	Malaysia	Thickness > 0.4 Room Temp Support Laser funtion
	ISM NX16	Cohu	7	X3 (0.3×0.6)	US	Room Temp
	ASM FT-Mini	ASM	20	0.6*0.3	China	Small package size
	Tesec 4170	TESEC	11	MLP >= 1×1	Japan	Package size 1×1 – 3×3 Up to 64 site
Strip Test	DPE K8	MI Equipment	8	MLP >= 1×1	Malaysia	12 inches capable
Strip Test	Hontech 7045	Hontech	13	MLP >= 3×3	China	Room and Hot Temp
Pick & Place	ADV 4841	ADV	12		Japan	Tri-temp Up to 8 sites
Pick & Place	JHT Exceed-8008	JHT	22		China

Turret handler roadmap

Remark: High Speedup(up to 50k UPH), Ambient test, T&R Integrated, Mini Package Prefer (<3*3mm), Mini Package Thickness 0.3mm

Strip test handler & picker roadmap

Pick and place handler roadmap

Remark: Hard docking, Ambient/Hot/Cold Test, Bake after test

Final Test Capability

SRM Z208, ISM NX16, ASM FT-MINI
Package 0.6*0.3mm (T: 0.3mm)
5 sides Vision Inspection
MTBA > 60 mins
Max UPH 50k

HT7045, HT1026, JHT Exceed-8008
Tri temp(-55~130 ºC ±2 ºC )
Max UPH 13k
16 sites max

Test Handler Develop Roadmap

Type

2006

2010

2015

2018

2022

Turret

>2mm*2mm T>0.45mm
*SRM XD248
*SRM F208

>0.6mm*0.3mm T>0.3mm
*A SM FT-mini
*Ismeca NX16

>0.6mm*0.3mm T>0.3mm
*SRM Z208 (High UPH)

>0.4mm*0.2mm T>0.25mm
*Ueno SeiKi

Pick & Place

Room Temp >3*3mm
*Hontech9040

Room Temp~120°c >3*3mm
*JHT 6000H

Room Temp~130°c >3*3mm
*JHT 8008H

Tri-Temp (-55~150°c) >3*3mm
*Hontech 1026

Scrip Test

>1*1mm up to 64 sites
*Tesec 4170

>0.6mm*0.3mm
*Mi DPE K8

>0.4*0.2mm
*MIE Mi30

SRM XD248

ASM FT-Mini

SRM Z208

HT7045

JHT8008

TESEC 4170-IH

Test Development

Carsem Suzhou, China

Overview

Test Development Capability

Test Solutions For RF Product

Low Cost Solution For TVS Product

RF FEM Test Technology Roadmap

Section5G RF PA/FEM Test Solution

Test Readiness for 5G RF product

FEM Categories Vs Test

Test 5G Preparedness

Sub-6GHz 5G PA/FEM test

Test Method of 5G mmWave

Test Equipment Roadmap

Tester Roadmap

Carsem Suzhou overall tester model

RF tester roadmap

TVS tester roadmap

Final Test Capability

STS T4 Tester

ACCO 8200 Tester

Tester Develop Roadmap

Handler Roadmap

Carsem Suzhou overall handler model

Turret handler roadmap

Strip test handler & picker roadmap

Pick and place handler roadmap

Final Test Capability

Turret Handler

Pick&Place Handler

Test Handler Develop Roadmap