<table id="arezw"></table>
<track id="arezw"><label id="arezw"></label></track>
  • <track id="arezw"></track>
    1. <table id="arezw"></table>

        <table id="arezw"></table>
            <p id="arezw"></p>
              <object id="arezw"><strong id="arezw"><noframes id="arezw">

              Power Management

                Power Management is the system which manages transitions between standby, sleep and high power modes by effectively delivering optimal electrical power to the various components in a system resulting in longer standby power and generally, the efficient use of available energy.


                • Power management devices are important for portable products that rely on battery power – networking and computing, wireless, automotive and motor control applications
                • By reducing power to components that aren’t being used, a good power management system can extend the lifetime of a battery.

                Carsem offers various solutions for Power Management.


                Cu Clip Thermal & RDSon Solutions


                • Improved MOSFET performance with lower RDSon
                • Enhanced thermal performance
                • Cost effectiveness to replace 20~30 heavy Au wires


                • Cu Clip products are used where power & thermal efficiency is critical
                • Commercial & Industrial applications
                • Motherboards, LED TV, laptop, small electric vehicles
                • Electronics in Server, Automation, Photo Voltaic etc.

                Carsem Offers

                • Multiple Cu Clip MOSFETs capability
                • Exposed Cu Clip option
                • High thermal conductive adhesives
                • One-stop from design to HVM (high volume manufacturing)
                • Full turnkey solutions for assembly & test

                Flip Chip Solutions


                Carsem’s FCOLTM (Flip Chip On Leadframe) comes with a flipped bump-die with pad pitches as small as 200 microns onto a lead frame.

                • Reduced form factors
                • Improves electrical performance
                • Improved thermal conductivity


                • Allows maximum use of silicon space
                • FCOL? is available in MLP, SOT23, SC70, QSOP and narrow body SOICs.
                • Ideal for RF & power management devices


                • 60% improvement in self-inductance and capacitance versus awire bonded version.
                • 15% lower thermal resistance.
                • Reduced resistance from typical 19 m-ohm to 0.6 m-ohm
                • MSL Level 1.
                • Withstands 260°C solder shock test.
                • Complete Assembly & Test Solution including RF testing, tape and reel plus drop ship.
                • Improve heat dissipation through expose die back structure
                • Direct flip FET process (without pre-formed solder bumps)

                Cu Clip