Carsem‘s MLP (Micro Leadframe Package) is a family of JEDEC compliant QFN and DFN plastic packages. This near CSP package family is available in two versions.
The primary package offering is a sawn package. This is offered in a quad configuration (MLPQ) and a dual configuration (MLPD). Standard body sizes are available from 0.6×0.3 to 12×12. Specialized and custom body sizes are also available on 0.1mm body size increments. These packages are offered in a variety of package thickness profiles。
A full range of turnkey test solutions and services are available for this package family.
MLP Quad/Dual
| MLP Popular Tooled Package Sizes |
| Standard MLP-Dual |
| 0.3 x 0.6 thru 5 x 6 mm |
| 2 – 22 I/O |
| Standard MLP-Quad |
| 2 x 2 thru 10 x 10 mm |
| 6 – 72 I/O |
CLICK to view MLP Surface Mount User’s Guide
Custom sizes are available upon request.
| Semi-Custom Packages Available in Selected 0.1 mm Body Size Increments |
| Carsem Suzhou: Footprint Compatible Packages |
| The terminals of these packages match the surface mount layouts of the following packages: SOIC, SOT23, SC70 Packages 0402 & 0201 & 01005 SMT Components |
| Carsem S Site: Footprint Compatible Packages |
| The terminals of these packages match the surface mount layouts of the following packages: SOIC, SOT23, SC70 Packages 0402 & 0201 SMT Components |
| Typical Terminal Pitch (e) |
| 1.27, 1.00, 0.95, 0.80, 0.65, 0.50, 0.40, 0.35 mm |
| Carsem Suzhou: Available Standard Package Profile Heights (A max) |
| 1.5, 1.2, 1.0, 0.80, 0.65, 0.55, 0.50, 0.40, 0.32 For other package height requirements, contact your local Carsem Sales Office |
| Carsem S Site: Available Standard Package Profile Heights (A max) |
| 1.0, 0.80, 0.65, 0.55, 0.50, 0.40, 0.32 For other package height requirements, contact your local Carsem Sales Office |
| MLPQ/D – EP | MLPQ/D – COL | MLPQ/D – FCOL | |
| Leadframe | CDA194 / C7025 / Eftec64T | ||
| Die Attach | QMI 519 | ABLESTIK 8006 | N.A. |
| Carsem Suzhou: Wire Bond | 0.7 / 0.8/0.9/1.0/1.3/2.0mil Au or Cu wire | N.A. | |
| Carsem S Site: Wire Bond | 0.8/0.9/1.0/1.3/2.0mil Au or Cu wire | N.A. | |
| Flipchip | N.A. | N.A. | Flux |
| Mold cpd | G770H series (Green) | ||
| Lead Finish | Matte Tin / NiPdAu | ||
| Marking | Laser (For Marking capability Click – Sawn) | ||
| Packing | Canister, Tube, Tray, or Tape & Reel | ||
| Process Flow | CFCS-MLP / CFCS-MLP-NiPdAu-CD | CFCA-FC-MLP-CD-TINP | |
| JEDEC Reference (Typical) | MLPQ-EP : MO-220 (<3×3 : MO-255) MLPD-EP : MO-229 (<3×3 : MO-252) |
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| MLPQ/DH-EP (Punched) | |
| Leadframe | C194 |
| Die Attach | Sumitomo 1076DJ |
| Wire Bond | 1.0mil Au wire |
| Mold cpd | E670 (Green) |
| Lead Finish | Matte Tin Plate |
| Marking | Laser (For Marking capability Click –Punch) |
| Packing | Tube, Tray or Tape & Reel |
| Process Flow | CFCM-MLPDH/QH-STD |
| JEDEC Reference (Typical) | MLPQ-EP : MO-220 MLPD-EP : MO-229 |
Reliability Data
| References Specifications | ||
| Mil Standard 883 for Test Method and Procedures | ||
| J-STD-20 Moisture/Reflow Sensitivity Classfication | ||
| IPC-9701 for Board Level Reliability |
| Reference Specifications | ||
| Autoclave | 1008 hours | 121°C / 100% RH, 2 atm |
| Temp. Cycle | 1000 cycles | -65°C / +150°C |
| Thermal Shock | 300 cycles | -55°C / +125°C |
| Board Stress | 2000 cycles | -40°C / +100°C |
Reliability & MSL Results
Please Contact Sales Office for Package Specific Results
Database
| CLICK to view MLP Datasheet | Clear MLP Datasheet | X3 MLP Datasheet |
| CLICK to view MLP Surface Mount User’s Guide |