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              Carsem (M) Sdn Bhd

              MEMS & Sensors - Inertial Hub

                Applications

                • Automotive Accederometers
                • Consumers IMU for smartphone, Gaming controllers, AR/VR, indoor navigation

                Package Offering

                • LGA
                • QFN/DFN
                • Custom Packages

                Key Technologies

                • Laser grooving/Low k Wafer
                • Backgrind to 100um (300mm)
                • Weltable flank step cut or side wall Etch options
                • Laminate, MIS, lead Frame (LF)
                • Transfer & Compression Molding
                • Integrated EMI Shielding in package
                • Wire AU (0.5mil-2.0mil) capability

                Applications

                • Automotive Accederometers
                • Consumers IMU for smartphone, Gaming controllers, AR/VR, indoor navigation

                Package Offering

                • LGA
                • QFN/DFN
                • Custom Packages

                Key Technologies

                • Laser grooving/Low k Wafer
                • Backgrind to 100um (300mm)
                • Weltable flank step cut or side wall Etch options
                • Laminate, MIS, lead Frame (LF)
                • Transfer & Compression Molding
                • Integrated EMI Shielding in package
                • Wire AU (0.5mil-2.0mil) capability
                国产精品午夜国产小视频