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              Assembly Overview

                Carsem offers innovative cost down and yield improvement solutions for various end applications. Our dedicated technology centre can partner with customers in developing new products, from prototyping to small scale production.

                Power Management

                MLP

                MEMS & Sensors

                SOIC

                MICRO

                Copper Clip

                LGA

                SIP

                Flip Chip

                TVS

                I.C

                QFP

                国产精品午夜国产小视频